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Zalman ZM-TG2

Zalman ZM-TG2

Effectively transfers heat from heat sources (CPU, VGA chipset Read more

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Specifications

Feature
Value
Comment
Type
Non-curing compound
Capacity
2.5ml (6.5g)
Specific Gravity
2.60
Temperature Stability
125 °C (257 °F)
Thermal Conductivity
1.2W/mK
Release Date
First seen
3 September 2008