Specifications

Feature	Value	Comment
feature	Application for Intel Xeon Dempsey 2U active solution
feature	Low noise and silent server cooler
feature	All copper solding Technology
feature	Heat-pipe designation provides better heat conductivity
feature	Dow Corning 5022 Interface material performs well
Specification
Heatsink Dimension	86.5 x 76.2 x 50.29 mm
Heatsink Material	Cu Base w/ Cu Fin
Socket Type	LGA 771
Fastener	Spring Screw
Fan Dimension	70 x 70 x 15 mm
Air Flow	23.49 CFM
Air Pressure	2.23 mmH2O
Bearing Type	1 Ball & 1 Sleeve
Fan Speed	3600 RPM (PWM)
Noise Level	29.1 dBA
Connector	4 Pin
Life Expectation	40,000 hrs
TIM	Dow Corning 5022
Total Weight	699 g
Release Date
First seen	2 July 2006

Thermaltake CLP0303